Solutions | Photonics
A PIC integrates tens to thousands of components on a single chip. Components are solved rigorously, the circuit with equivalent models. How you build that hierarchy, and where you can join it without losing accuracy, is what the design turns on.
Design challenges
From the tens of micrometers of a grating coupler to the centimeters of a circuit. No single electromagnetic analysis covers that range. Solve the components rigorously, compress them into compact models, then reassemble as a circuit. Accuracy is quietly lost at every compression, so you need a structure that lets you trace which data each model rests on.
Design and simulation workflow
Solve the electromagnetic response of each component. For active components, solve carriers and heat as well.
Reduce to the S-parameters and effective indices the circuit model needs.
Organize them into a versioned, verified model library.
Build the schematic and evaluate frequency and transient response.
Drive the layout from the schematic, then re-verify against real coordinates.
Obtain yield by corner analysis and Monte Carlo, and co-verify with the electronics.
The stages differ by project. You can bring an existing PDK or model assets and start partway through.
Related analysis technologies
The principles and scope of each method are explained on the Analysis Technologies pages.
Related products
The capabilities and coverage of each product are described on its own product page.
Handles rigorous analysis of passive components. Three-dimensional FDTD gives the electromagnetic response of each component.
Stage / 01-02
Handles waveguide and mode analysis and planar propagation. FDE, EME and varFDTD are used according to the structure.
Stage / 01-02
Handles active component and thermal analysis. CHARGE and HEAT give carrier transport and temperature distribution.
Stage / 01-02
Handles compact model generation. Extracted parameters are organized into a versioned model library.
Stage / 03
Handles circuit analysis and yield evaluation. Covers frequency and transient response, corner analysis and Monte Carlo.
Stage / 04-06
Foundry and manufacturing
Once the circuit layout is settled, you move to prototyping through a multi-project wafer (MPW) or a dedicated run. Before handover, confirm that the design follows the process design kit of the target platform and that the layout you output matches the constraints of the manufacturing route you have chosen.
Whether prototyping and manufacturing are possible, and in what form, is judged case by case from the target platform and process conditions.
Related technical information
Tell us where the design stands, whether you have a PDK, what model assets already exist, and what you need to verify, and we will propose a way forward.